LAKO is the industry thought-leader for package sealing technology. While holding several intellectual properties that shaped the sealing technology today, Lako is committed to innovation and customer satisfaction.
Split Crimper For Heat Sealing Packaging Material
Patent: US-7730698-B2 Issue Date: 06/08/2010
Application: 11/305,746 Application Date: 12/16/2005
Modular Sealing Device (MSD)
A split crimper for use in a crimping assembly for engaging and heat sealing overlapping layers of a packaging material includes a first crimper portion having a crimping surface and a second crimper portion that is secured to the first crimper portion to form a crimper. Portions of the first and second crimper portions cooperate to define an interior cavity, and a heating element is disposed completely within the interior cavity.
Split Crimper For Heat Sealing Packaging Material
Patent: US-8146327-B2 Issue Date: 04/03/2018
Application: 13/082,208 Application Date: 04/07/2011
Modular Sealing Device (MSD)
A split crimper for use in a crimping assembly for engaging and heat sealing overlapping layers of a packaging material includes a first crimper portion having a crimping surface and a second crimper portion that is secured to the first crimper portion to form a crimper. Portions of the first and second crimper portions cooperate to define an interior cavity, and a heating element is disposed completely within the interior cavity.
Split Crimper For Heat Sealing Packaging Material
Patent: US-8387344-B2 Issue Date: 03/05/2013
Application: 13/404,695 Application Date: 02/24/2012
Modular Sealing Device (MSD)
A split crimper for use in a crimping assembly for engaging and heat sealing overlapping layers of a packaging material includes a first crimper portion having a crimping surface and a second crimper portion that is secured to the first crimper portion to form a crimper. Portions of the first and second crimper portions cooperate to define an interior cavity, and a heating element is disposed completely within the interior cavity.
Hot Punch Assembly For Providing An Opening In Packaging Material
Patent: US-8256189-B2 Issue Date: 09/04/2012
Application: 12/542,851 Application Date: 08/18/2009
Hot Punch Assembly
A punch assembly is provided in a form, fill, and seal machine that provides a package that includes a sealed end portion and contains an article. The punch assembly includes a housing, and a heat sink provided in and retained by the housing, where the heat sink includes a punch tip that is to provide an opening in the sealed end portion of the package. The punch assembly also includes a coil heater contacting the heat sink to provide heat to the heat sink and the punch tip, where one or more air gaps are provided between the housing and the heat sink to prevent heat transfer from the heat sink to a seal jaw assembly of the form, fill, and seal machine.
HCP Part Numbers
I500820
I500825
I500830
I500945-F
I500945-G
I500950-F
I500950-G
I500950-H
I500950-I
I500950-J
I500950-K
I500950-L
I500950-M
I500950-F
I500950-G
I500950-H
I500950-I
I500950-J
I500950-K
I500950-L
I500950-M
I500952-C
I500970
I500990
I501005-H
I501005-J
I501005-K
I501007-F
I50095
I501015
I501025
I501030
I501035
I501070